Product introduction
Short for low-profile Quad Flat Package, thin four-side lead Flat Package, plastic sealing body thickness of 1.4mm

Product features
The technology realizes the chip pin distance is very small, the pin is very thin. Generally large scale or very large scale integrated circuit adopts this form of packaging, its pin number is generally more than 32, can be expanded to hundreds of pins. This technology is convenient to operate and has high reliability when packaging chips. Besides, its package size is small and parasitic parameters are reduced, so it is suitable for high frequency applications.

Application
Is one of the most mature industry packaging standards, used in 3C digital, smart home, automotive electronics, power metering products.

Process characteristics
Refer to or meet JEDEC standards
Customized design lead frame design and multi-specification pad size to meet different customer needs
Green manufacturing, lead-free process

Reliability test standard
The test criteria is zero defects in 77 sampling units
JEDEC Prerequisite: J-STD-20/JESD22-A113
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature cycle test: -65~150 ℃, JEDEC22-A104
High temperature storage test: 150°C, JEDEC 22-A103
High acceleration stress test: 130°C/85% rh /33.5 PSIA, JEDEC 22-A110/A118